Thermal interface

ABSTRACT

Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.

RELATED APPLICATION

This application is a divisional of U.S. application Ser. No.10/750,488, filed Dec. 31, 2003, now U.S. Pat. No. 7,612,370 which isincorporated herein its entirety by reference.

TECHNICAL FIELD

The embodiments of the invention generally relate to cooling electronicapparatuses and systems, including thermal interface material.

BACKGROUND INFORMATION

As electronic devices become more powerful and smaller (i.e., moredensely packed), the power consumed by these electronic devices canresult in a large amount of generated heat. The heat generated by theseelectronic devices may be detrimental to the operation of the electronicdevices. Accordingly, a common concern associated with electroniccomponents is heat removal.

For example, an electronic device may include an integrated circuit (IC)die. A thermal management device may be thermally coupled to the IC dieto facilitate dissipation of heat from the IC die. Commonly, the thermalmanagement device may be in the form of a heat sink type device.Accordingly, heat may be transferred from the IC die to the thermalmanagement device, and in turn, the thermal management devicefacilitates transfer of the heat to the surrounding environment.

BRIEF DESCRIPTION OF THE DRAWINGS

The various embodiments of the invention is illustrated by way ofexample and not by way of limitation in the figures of the accompanyingdrawings, in which the like references indicate similar elements and inwhich:

FIG. 1 illustrates an apparatus having an interface comprising a numberof nanostructures, in accordance with various embodiments of theinvention;

FIG. 2 illustrates an interface having a number of nanostructures, inaccordance with one embodiment of the invention;

FIG. 3 illustrates an interface having a number of nanostructures, inaccordance with another embodiment of the invention;

FIG. 4 illustrates an interface having a number of nanostructures, inaccordance with another embodiment of the invention;

FIG. 5 illustrates an apparatus having an interface having a number ofnanostructures, in accordance with various embodiments of the invention;and

FIG. 6 illustrates one of many possible systems in which embodiments ofthe present invention may be utilized.

DETAILED DESCRIPTION

In various embodiments, an apparatus having an interface comprising anumber of nanostructures disposed between a thermal management deviceand a heat source is described. In the following description, variousembodiments will be described. However, one skilled in the relevant artwill recognize that the various embodiments may be practiced without oneor more of the specific details, or with other methods, materials,components, etc. In other instances, well-known structures, materials,or operations are not shown or described in detail to avoid obscuringaspects of various embodiments of the invention. Similarly, for purposesof explanation, specific numbers, materials and configurations are setforth in order to provide a thorough understanding of the embodiments ofthe invention. Nevertheless, the embodiments of the invention may bepracticed without the specific details. In other instances, well-knownfeatures are omitted or simplified in order not to obscure theembodiments of the invention. Furthermore, it is understood that thevarious embodiments shown in the figures are illustrativerepresentations and are not necessarily drawn to scale.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, material, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention. Thus, the appearances ofthe phrases “in one embodiment” or “in an embodiment” in various placesthroughout this specification are not necessarily all referring to thesame embodiment or invention. Furthermore, the particular features,structures, materials, or characteristics may be combined in anysuitable manner in one or more embodiments.

Various operations will be described as multiple discrete operations inturn, in a manner that is most helpful in understanding the embodimentsof the invention. However, the order of description should not beconstrued as to imply that these operations are necessarily orderdependent. In particular, these operations need not be performed in theorder of presentation.

FIG. 1 illustrates an apparatus having an interface comprising a numberof nanostructures, in accordance with various embodiments of theinvention. Illustrated in FIG. 1 is cross sectional side like view of anapparatus 100. In FIG. 1, the apparatus 100 includes a thermalmanagement device 102, a heat source 104, and an interface 106 disposedbetween the thermal management device 102 and the heat source 104. Inaccordance with various embodiments, the interface 106 has a number ofnanostructures. As will be described in further detail, the interface106 facilitates at least improved adhesion and thermal conductivitybetween the thermal management device 102 and the heat source 104.

In various embodiments, the thermal management device 102 may be part ofa passive cooling device such as, but not limited to, a heat sink, aheat spreader, heat pipes, a heat slug, and the like, and anycombination thereof. Alternatively, in various embodiments, the thermalmanagement device 102 may be part of an active cooling device such as,but not limited to, an air jet impingement device, a dielectric liquiddevice, and any combination thereof.

In various embodiments, the heat source 104 may include an integratedcircuit (IC), which may be in the form of a rectangular piece ofsemiconductor material commonly known as a chip or a die. Some examplesof semiconductor material may include, but are not limited to, silicon,silicon on sapphire, silicon on insulator, gallium arsenide, and anycombination thereof.

FIG. 2 illustrates an interface having a number of nanostructures, inaccordance with one embodiment of the invention. In FIG. 2, a detailedview of an interface 206 between a heat source 204 and a thermalmanagement device 202 is shown. The interface 206 includes a number ofnanostructures 208. In the embodiment illustrated, the nanostructures208 may be formed on the heat source 204, while the thermal managementdevice 202 does not necessarily have nanostructures 208. Further, thenanostructures 208 are shown extending away from the heat source 204.

In various embodiments, the nanostructures 208 may comprise of carbonnanotubes. That is, each of the nanostructures 208 may have anapproximate diameter of 0.6 to 1.8 nanometers, and a length ofapproximately 1-100 microns. The carbon nanotubes may be single walled,multi-walled, of various shapes, and may be coated with various coatingssuch as, but not limited to, metals. Accordingly, each of thenanostructures 208 may have relatively high heat transmission abilitiessuch as, but not limited to, as high as 6000 Watts per meter Kelvin,thereby facilitating improved heat transfer between the heat source 204and the thermal management device 202. Further, the nanostructures 208may be formed from a variety of manners such as, but not limited to,utilizing an arc fullerene generator, chemical vapor deposition (CVD),and laser blasting.

Continuing to refer to FIG. 2, in the illustrated embodiment, thenanostructures 208 may facilitate adhesion between the heat source 204and the thermal management device 202 due to various interactionsbetween the nanostructures 208 and the thermal management device 202.For example, the nanostructures 208 may be attracted to thermalmanagement device 202, in particular, to the surface of the thermalmanagement device 202, due to Van der Waals' type forces.

In various embodiments, the nanostructures 208 may have molecules thathelps to facilitate adhesion. For example, in one embodiment, thenanostructures 208 may have molecules in the form of flexible polymerssuch as, but not limited to, single stranded deoxyribonucleic acid (DNA)molecules. The molecules facilitate covalent type bonding between thenanostructures 208 and the thermal management device 202. Utilization ofmolecules with various nanostructures such as carbon nanostructures isknown, and accordingly, will not be described in further detail.

In the embodiment illustrated in FIG. 2, the nanostructures 208 may beformed on the heat source 204. However, in alternate embodiments, thenanostructures 208 may be formed on the heat management device 202.Further, as will be described in detail, the nanostructures 208 may beformed on both the thermal management device 202 and the heat source204. Additionally, the nanostructures 202 are shown substantiallyextending away from a surface. However, it should be appreciated thatthe nanostructures 202 may be formed in a variety of directions andmanners including, but not limited to, various angles relative to asurface.

As a result, the interface 206 having the nanostructures facilitatesimproved heat transfer and adhesion between the heat source 204 and thethermal management device 202.

FIG. 3 illustrates an interface having a number of nanostructures, inaccordance with another embodiment of the invention. As shown in FIG. 3,an interface 306, between a thermal management device 302 and a heatsource 304, includes a number of nanostructures 308 & 310. In theillustrated embodiment, the nanostructures 308 & 310 may be formed onboth the thermal management device 302 and the heat source 304. Further,the nanostructures 308 & 310 extend away from their respective surfaces(i.e., nanostructures 308 formed on the thermal management device 302extend toward the nanostructures 310 formed on the heat source 302. Asshown, the nanostructures 308 formed on the thermal management device302 may interleave with the nanostructures 310 formed on the heat source304.

The interleaved nanostructures 308 & 310 may be carbon nanotubes likestructures, and accordingly, the interleaved nanostructures 308 & 310may adhere to each other due to various attraction forces such as, butnot limited to, Van der Waals' forces as previously described.Additionally, heat transfer between the thermal management device 302and the heat source 304 may be improved due to the nanostructures 308 &310 being made of nanostructures having relatively high thermalconductivity.

In various embodiments, the nanostructures 308 & 310 may have moleculesthat facilitate adhesion, as previously described. For example, thenanostructure 308 formed on the thermal management device 302 and/or thenanostructure 310 formed on the heat source 304 may have molecules thatfacilitate adhesion. That is, the nanostructures 308 & 310 may havemolecules in the form of flexible polymers on either or both of thenanostructures 310 formed on the heat source 304 and the nanostructures308 formed on the thermal management device 302. As previouslydescribed, the molecules facilitate covalent type bonding between thenanostructures 308 & 310.

FIG. 4 illustrates an interface having a number of nanostructures, inaccordance with another embodiment of the invention. In FIG. 4, aninterface 406 between a thermal management device 402 and a heat source404 is shown in detail. As shown in FIG. 4, the heat source 404 may havea number of nanostructures 410 that may be disposed in a predeterminedmanner to further facilitate coupling of a number of nanostructures 408that may be disposed on the thermal management device 402. That is, inthe embodiment illustrated in FIG. 4, the nanostructures 410 on the heatsource 404 may be disposed in a pattern to receive the nanostructures408 on the thermal management device 402, which may also be in a patternto be received by the nanostructures 410 on the heat source 404 (e.g.,male/female type pattern). Accordingly, the nanostructures 410 on theheat source 404 may be disposed to have recesses 412 while thenanostructures 408 on the thermal management device 402 may be disposedto have protrusions 414 that may be received into the recesses 412.

The nanostructures 408 and 410 may be carbon nanotubes like structures,and may also have molecules to facilitate adhesion of the nanostructures408 and 410 to each other, which in turn, facilitate adhesion of thethermal management device 402 and the heat source 404.

FIG. 5 illustrates an apparatus having an interface having a number ofnanostructures, in accordance with various embodiments of the invention.In FIG. 5, apparatus 500 may include a heat source 504 thermally coupledto an interface 506. Additionally, a thermal management device 502 isshown thermally coupled to the interface 506. In turn, the thermalmanagement device 502 is shown being thermally coupled to a heatdissipation device 510. Disposed between the heat management device 502and the heat dissipation device 510 may be a second interface 508. Theinterface 506 and/or the second interface 508 may be of the typepreviously described with respect to FIGS. 1-4 or any combinationthereof. In the illustrated embodiment, the heat source 504 may be inthe form of an IC die, which may include integrated electrical devicesand may be fabricated utilizing any suitable material and fabricationmethods. In various embodiments, the heat source may comprise amicroprocessor type chip having a silicon type substrate, as previouslyalluded to.

The heat source 504 may be electrically coupled to a substrate 520 via anumber of solder bumps 522. The substrate 520 may be electricallycoupled to a wiring board 524 via solder balls 526. In the illustratedembodiment of FIG. 5, the heat source 504 having the solder bumps 522,the interface 506, and the thermal management device 502 may be referredto as a semiconductor package. Accordingly, interfaces 506 and 508 mayfacilitate heat transfer and adhesion of various components of asemiconductor package.

Illustrated in FIG. 5, the thermal management device 502 may bethermally coupled to the heat dissipation device 510. However, it shouldbe appreciated by those skilled in the relevant art that the heat source504 may be thermally coupled directly to the heat dissipation device510. That is, as previously alluded to, the thermal management device502 may be a heat dissipations device as well.

FIG. 6 illustrates one of many possible systems in which embodiments ofthe present invention may be utilized. In FIG. 6, a system 600 mayinclude apparatus 610 which may be similar to the apparatus 500 shown inFIG. 5 having a heat source, a thermal management device, and aninterface between the thermal management device and the heat source,where the interface has a number of nanostructures. Further, theapparatus 610 may be electrically coupled to a wiring board, which inturn, may be electrically coupled to various components.

In the illustrated embodiment of FIG. 6, a system 600 may include amemory device 612, a graphic processor 614, a mass storage device 616,and an input/output module 618 coupled to each other by way of a bus620, as shown. Examples of memory device 612 include flash type memory,static random access (SRAM) memory, and dynamic random access memory(DRAM). Examples if mass storage device 616 include, but are not limitedto, a hard disk drive, a compact disk drive (CD), a digital versatiledrive (DVD), and so forth. Examples of the input/output modules 618include, but not limited to, a keyboard, cursor control devices, adisplay, a network interface, and so forth. Examples of bus 620 include,but not limited to, a peripheral control interface (PCI) bus, andIndustry Standard Architecture (ISA) bus, and so forth. In variousembodiments, the system 600 may be a wireless mobile phone, a personaldigital assistant, a pocket PC, a tablet PC, a notebook PC, a desktopcomputer, a set-top box, an entertainment unit, a DVD player, a server,and so forth.

Having described and illustrated the principles of the embodiments ofthe invention with reference to illustrated embodiments, it will berecognized that the illustrated embodiments can be modified inarrangement and detail without departing from such principles. And,though the foregoing discussion has focused on particular embodiments,other configurations are contemplated. In particular, even thoughexpressions such as “in one embodiment,” “in another embodiment,” or thelike are used herein, these phrases are meant to generally referenceembodiment possibilities, and are not intended to limit the embodimentsof the invention to particular embodiment configurations. As usedherein, these terms may reference the same or different embodiments thatare combinable into other embodiments.

Thus, it can be seen from the above descriptions, a novel apparatusincluding an interface between a heat source and a thermal managementdevice having a number of nanostructures has been described.

The above description of illustrated embodiments of the invention,including what is described in the Abstract, is not intended to beexhaustive or to limit the embodiments of the invention to the preciseforms disclosed. While specific embodiments of, and examples for, theinvention are described herein for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. Thus, thedescription is to be regarded as illustrative instead of restrictive onthe embodiments of the invention.

Consequently, in view of the wide variety of permutations to theembodiments described herein, this detailed description is intended tobe illustrative only, and should not be taken as limiting the scope ofthe invention. What is claimed as the embodiments of the invention,therefore, is all such modifications as may come within the scope andspirit of the following claims and equivalents thereto.

1. An apparatus comprising: a substrate; a heat source coupled to thesubstrate; a thermal management device coupled to the heat source; andfirst nanostructures and second nanostructures disposed between thethermal management device and the heat source, at least onenanostructure of the first nanostructures including a first end attachedto the thermal management device and a second end attached to none ofthe thermal management device and the heat source, and at least onenanostructure of the second nanostructures including a first endattached to the heat source and a second end attached to none of thethermal management device and the heat source.
 2. The apparatus of claim1 further comprising: a heat dissipation device; and thirdnanostructures disposed between the heat dissipation device and thethermal management device.
 3. The apparatus of claim 2 furthercomprising: a board; and solder coupled between the board and thesubstrate.
 4. The apparatus of claim 3 further comprising solder coupledbetween the heat source and the substrate.
 5. The apparatus of claim 4,wherein the thermal management device forms an enclosure over thesubstrate to enclose the heat source.
 6. The apparatus of claim 1,wherein the thermal management device includes a cooling device, and theheat source includes a circuit.
 7. The apparatus of claim 1, wherein thefirst nanostructures include protrusions, and the second nanostructuresinclude recesses to receive the protrusions.
 8. The apparatus of claim1, wherein at least one of the first and second nanostructures includescarbon nanotubes.
 9. The apparatus of claim 1, at least one of the firstand second nanostructures includes deoxyribonucleic acid (DNA)molecules.
 10. The apparatus of claim 1, wherein at least onenanostructure of the first nanostructures has a diameter of 0.6 to 1.8nanometers.